Production Capability
| Technical Specification for PCB | |
|---|---|
| Product Range | 1. FR-4, (Tg140 to Tg180), CEM-3, Halogen-Free Materials 2. Aluminum base Material |
| Laminate Thickness | 0.4~3.2mm:up to 16 Layers |
| Copper Foil Thickness | 18um to 140um(0.5oz~4oz) |
| Minimum Finished Hole | Ø 0.1mm(4mil) |
| Minimum Line Width | 0.07mm(3mil) |
| Minimum Air Gap | 0.07mm(3mil) |
| Minimum BGA(Filp Chip) | Ø 0.13mm(5mil) |
| Fine SMD Pitch | 0.07mm(3mil) |
| Maximum Panel Size | 457mm x 609mm(18″ x 24″) |
| Surface Finishing | 1). Electroless Ni/Au Plating 2). Soft / Hard Au Plating 3). Carbon Ink/ Silver Ink 4). OSP 5). Lead-Free Hot Air Levelling 6). Electroless Pure Tin /silver |
| Solder-Mask Finishing | 1). Wet Film (LPI Soldermask) 2). Peelable Soldermask |
| Profile | 1). CNC Routing (±0.1mm) 2). CNC V-Cut(±0.05mm) 3). Bevelling 4). Mould-Die Punching(±0.1mm) |